Glove box system & High-vacuum resistance thermal evaporation coater，Deposition & Metallization System up to 100mm x 100mm Substrate

Glove box system

Description

Material: Stainless steel type 304, thickness 3 mm
Dimensions: 1800mm(L) x 750mm(W) x 900mm(H) + 1200mm(L) x 750mm(W) x 900mm(H)

Volume

1.2m³+0.8m³

Front window

Panel: 8 mm thick safety tempered glass or 10 mm thick polycarbonate (optional)

Glove ports

Material: Hard aluminum alloy or polyoxymethylene (optional)
Aperture: 220 mm, O-ring sealed

Gloves

Material: Butyl rubber
Thickness: 0.4 mm

Filter

Inlet and outlet filters, filtration <0.3μm

Lighting

LED lighting located at the top of the front window

Leak rate

≤ 0.05 vol%/h

Single-column gas purification system (two sets)

Description

Automatically removes H2O and O2
Single purification column system, auto-regenerative (optional GP200 dual-column system available)
Sealed gas circulation pipeline

Voltage

AC 230 V / 50-60 Hz, 10 A

Working gas

Working gas: N2, Ar, He (purity ≥99.999%)
Regeneration gas: 5%–10% H2, balance working gas (purity ≥99.999%)

Vacuum pump

Specifications: Rotary vane vacuum pump, equipped with oil mist filter and gas ballast control
Flow rate: 12 m³/h (7 cfm), dual-stage, vacuum level <2×10⁻³ mbar, or dry pump (optional)

Circulation unit

Oil-free high-speed blower
Airflow: 0-100 m³/h

Valve

Burkert solenoid valve, modular design, excellent sealing performance

Leak rate

≤ 0.05 vol%/h

Control cabinet dimensions

600mm（L） x 800mm（D） x 870mm（H）

Transfer chamber

T-type large transfer chamber

Material

Stainless steel type 304, thickness 3 mm

Dimensions

φ360mmx700mm(L)

Vacuum level

< 1 x 10-2 mbar

T-type small transfer chamber

Material

Stainless steel type 304, thickness 2 mm

Dimensions

φ150mm x 700mm(L)

Vacuum level

< 1 x 10-2 mbar

Large transfer chamber

Material

Stainless steel type 304, thickness 3 mm

Dimensions

φ360mmx600mm(L) 或φ390mmx600mm(L)( optional )

Vacuum level

< 1 x 10-2 mbar

Small transfer chamber

Material

Stainless steel type 304, thickness 2 mm

Dimensions

φ150mm x 330mm(L)

Vacuum level

< 1 x 10-2 mbar

Puring system

Description

Set the corresponding time and pressure, and the system can automatically perform gas replacement for the chamber.

Analyzer

O₂ analyzer

Dimensions

205 mm（L） x 80 mm（W） x 60 mm（H）

Measurement range

0-1000 ppm

Other oxygen analyzers

GE oxy.IQ™ Oxygen Transmitter

H₂O analyzer

Dimensions

205 mm（L） x 80 mm（W） x 60 mm（H）

Measurement range

0-500 ppm

Other moisture analyzers

GE VeriDri™ Dew-Point Transmitter

Solvent purification system

Description

Casing material

Stainless steel 1.4301 (SUS type 304), thickness 3 mm

Internal dimensions

220mm(Φ) x 450mm(H)

Filling material

High-quality activated carbon

Optional equipment

Low-temperature freezer

Temperature

Room temperature ~ -35℃

Volume

18L and 32L options available

Structure

5 adjustable shelves

Material

304 stainless steel

Refrigerant

R404

Heating chamber

The large transfer chamber is equipped with a heating system, with a temperature of 200°C and temperature control accuracy of ±1°C.

Modular Process Chamber

Dimensions

400mm（W）×400mm(H)×450mm(D)

Material

Stainless steel 1.4301 (SUS type 304), thickness 5mm; all welded joints use automatic argon arc welding technology; inner surface mirror-polished, outer surface triple-treated.

Volume

0.072m³

Observation window

The door is equipped with a glass observation window (including an anti-contamination baffle) for convenient monitoring of the working process.
Complies with national standards for X-ray protection.

Ultimate vacuum

≤6. 67x10-5pa （2×10-7Torr）(After baking and degassing)

Vacuum recovery

≤6.67X10-4 pa (After baking and degassing)

Interface

Three standard interfaces (φ200), for extended installation of molecular pumps and gate valves.

Lighting

LED lighting located on the side of the vacuum chamber.

Lighting

Leak testing is performed on the chamber according to GB/T 32218-2015, with final  acceptance testing conducted to meet the standard of ≤1×10⁻¹⁰ Pa·L/s.

Vacuum system

Description

Utilizes a high-vacuum system with "molecular pump + mechanical pump"

Molecular pump

Pumping speed

1200L/S

Vacuum pump

Specifications

Rotary vane vacuum pump, equipped with an oil mist filter and gas ballast control.

Flow rate

36 m³/h (21 cfm)

Vacuum level

< 2 x 10-3 mbar

Operating voltage

AC 230 V / 50-60 Hz, 10 A 或AC 115 V / 50-60 Hz, 20 A （optional）

Pumping speed

From atmosphere to ≤9×10⁻⁴ Pa in ≤30 minutes (after brief atmospheric exposure, start pumping after purging with dry nitrogen)

Valve

Main valve

CC-200, high-vacuum electrically interlocked gate valve

Foreline valve / Bypass valve

CC-200, high-vacuum electrically interlocked gate valve

Vacuum measurement

"Two low and one high" (two Pirani gauges for low vacuum, one ionization gauge for high vacuum). Digital composite vacuum gauge with a measurement range from 1×10⁵ Pa to 1×10⁻⁵ Pa; displayed and controlled via PC, enabling operational interlocking.
Optional imported wide-range vacuum transducer.

Sealing

Partially metal-sealed, partially sealed with fluororubber O-rings;

Substrate holder

Description

The sample stage is made of 304 stainless steel, with the substrate positioned directly above the evaporation source (fully automatic lifting function). The fixture is designed according to the substrate size for easy sample fixation. Customizable integrated high-precision etching mask plates are available.

rotation

The rotation is driven by a stepper motor with magnetic fluid sealing. The motor and magnetic fluid are coaxial, preventing issues like step loss or crawling. The stepper motor ensures precise control, with a continuously adjustable speed range of 0-30 rpm.

lifting

The rotation is driven by a stepper motor with magnetic fluid sealing, ensuring precise control. The height is continuously adjustable within a range of 0-100mm.

masking

Drawer-type structure, accommodating samples up to 120×120mm. Equipped with a Japanese SMC pneumatic substrate shutter and fully automated electrical interlocking control.

Evaporation source

Evaporation source

Structure

Utilizes a water-cooled copper electrode + evaporation boat structure. Anti-contamination baffles are installed between evaporation sources, and each source is equipped with a positioning baffle. Intelligent PC control is implemented.

Evaporation temperature

Room temperature~1300℃

Evaporation source

Output power

0~3000W, current regulated via inverter technology for stable and reliable operation. The power supply allows continuous adjustment from 0 to maximum power.

Control

RS-485 interface, with continuous power adjustment from 0 to maximum power.

Quantity

2 units, with automatic switching control.

Control system

Description

The system adopts a Windows operating platform and Ctrl2000 control system, utilizing IPC + network technology to achieve parameterized configuration of main components, real-time monitoring, intelligent fault diagnosis, and fully automated film thickness monitoring. It offers both automatic and manual control modes.

Except for sample loading/unloading, all other operations are controlled via software on the PC. It provides user-friendly interfaces for the vacuum system, process settings, and gas purging/venting systems.

Parameters can be set via recipes on the industrial computer, enabling configuration, storage, and printing of process procedures and equipment parameters.

Features

It effectively ensures the accuracy, stability, and reliability of the coating process.

The system features comprehensive program interlocks, foolproof operation design, and protection mechanisms. It alerts and executes protective measures in case of abnormalities such as water shortage, overcurrent, or overvoltage.

Designed with abundant I/O interfaces to fully meet the functional requirements for expansion and external device connectivity.

Displays and controls the opening/closing of the coating machine's chamber door.

Coating processes, procedures, and film thickness can be conveniently managed, saved, and printed.

Film thickness monitoring and control system

Description

A quartz crystal monitor is used for film thickness control, with a water-cooled thickness probe installed near the substrate holder and connected to the industrial computer. The thickness monitor provides real-time monitoring of the deposition rate and final thickness, with an accuracy of ±1Å (0.1nm). Real-time data is fed back to the industrial computer. If the deposited film reaches the preset thickness, the system can automatically control the power supply to stop the deposition, achieving automated thickness control.

Range

Monitoring thickness range: 1Å to 999,999Å, resolution 1Å; Monitoring rate range: 0.1Å to 9999.9Å/s, resolution 0.1Å.

Features

Coating processes, procedures, and film thickness settings are all configured on the PC, enabling full-process automated control. Coating parameters can be set and data recorded via the PC.

Water cooling system

Description

The cooling water system features 8 inlets and 8 outlets, with the main water supply controlled by a water pressure relay.

The main inlet and outlet are connected to a 1P refrigeration chiller, with a temperature control range of 10–25°C. It provides stable cooling water for targets, metal sources, molecular pumps, and magnetic fluid seals, ensuring stable equipment operation.

Optional equipment

Substrate holder

Heating

Utilizes vacuum-specific armored heating wires, avoiding issues such as contamination of the vacuum chamber and substrate, short lifespan, and frequent maintenance associated with traditional heating elements. The heating temperature ranges from room temperature to 300°C, with temperature control provided by an imported Japanese Shimaden PID intelligent temperature controller, achieving an accuracy of ±1°C.

Water cooling

The rotation is driven by a stepper motor with dynamic sealing, featuring one inlet and one outlet water flow.

Liquid nitrogen cooling

The rotation is driven by a stepper motor with magnetic fluid sealing, where the motor and magnetic fluid are coaxial. The measured temperature reaches -160°C.

Liquid nitrogen cooling

Multi-sample coating with automatic alignment and  repositioning, adjustable deposition height.

Liquid nitrogen cooling

Multi-sample coating with automatic alignment and repositioning, adjustable deposition height.

Stepless tilting and rotation

Enables both horizontal and vertical rotation of the substrate, with stepless rotation and heating, achieving highly uniform coating deposition.

Vacuum baking/degassing

Dual-heater design;
Power: 1200 W;
Mounting flange: CF35;
Rapidly degasses the vacuum chamber to improve vacuum level;
Shorter baking time compared to baking ovens and heating tapes.

Sample loading chamber

Structure: Open-door design, dimensions approximately Ø200 × 300mm
Vacuum system: Mechanical pump, molecular pump, valves
Ultimate vacuum: ≤6.67×10⁻⁴ Pa (after baking/degassing)
Vacuum recovery time: Reaches 6.6×10⁻³ Pa within 30 minutes (after brief atmospheric exposure and purging with dry nitrogen)

Chamber heating

The vacuum chamber is equipped with a heating system, maintaining a temperature of 200°C with a control accuracy of ±1°C.

Water cooling system

The cooling water system features 8 inlets and 8 outlets, with the main water supply controlled by a water pressure relay.
The main inlet/outlet is connected to a 1P refrigeration chiller (temperature control range: 10–25°C), providing stable cooling water for:
Metal evaporation sources
Molecular pumps
Magnetic fluid seals
Ensures stable and reliable equipment operation.

Other specifications

Product certification

ISO 9001 certification, CE certification, UL certification

Warranty period

One-year warranty, lifetime maintenance.

Application notes

For details, refer to the Danger, Warning, and Caution clauses in the instruction manual.

Packaging dimensions(W×D×H)

Weight