Vacuum Reflow Soldering Ovens

Vacuum Reflow Soldering Ovens

Picture

Features

Industrial control computer, English operation interface;

Heating method: infrared radiation heating;

Heating carrier: high thermal conductivity hard alloy plate;

Cooling method: nitrogen cooling;

Furnace cover locking method: pneumatic/automatic locking, alarm if not locked;

Operation mode: automatic and manual;

The user can set the process curve by himself and monitor the set process curve in real time;

Automatic running process curve record storage function;

Water cooling protection function (furnace cover and observation window sealing ring, cooling plate), cooling water is provided by the cooling water circulation system provided by the equipment;

The control software has error-proof interlock and over-temperature alarm function;

Configure formic acid module, can use formic acid process gas.

The vacuum and inflation systems are corrosion-resistant specifications.

It can set and control the functions of vacuuming, heating, filling with inert gas, formic acid, and inflation flow.

Technical Parameter

Solderable solder melting point ≤450℃

Temperature control accuracy≤±1℃

Effective heating area: (305×228) mm2

The thermal uniformity within the effective area≤±1.5%

Limit vacuum≤5Pa

Working vacuum: 10-15Pa

Maximum heating rate ≥2℃/S

Maximum cooling rate ≥1.5℃/S

Maximum height of placeable device≤80mm

Use environmen

Occupation area: 1.5×1.2m

Power supply: 380V, 50/60Hz

Power: 9kW

Equipment weight: ≤300Kg

Temperature: 10℃～40℃

Humidity: less than 60%RH

Noise: less than 40dB

Compressed air pressure: 0.3 ～0.5 MPa (Driving gas)

Nitrogen pressure: 0.2～0.4MPa (Process gas)

Packing List

Main unit of vacuum eutectic reflow oven × 1

Vacuum pump and vacuum pump accessories × 1

Chiller and accessories×1

User manual ×1

Qualification Certificate ×1

Warranty Card ×1

Options

Vision system ×1

Formic acid reduction system×1